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Overview xMEMS has unveiled a revolutionary cooling solution with its XMC-2400 µCooling chip—a 1mm-tall solid-state fan designed to address overheating issues in ultra-thin devices like smartphones and tablets. This breakthrough is rooted in MEMS (Micro-electromechanical systems) technology, similar to the company's upcoming ultrasonic drivers for headphones. The XMC-2400 promises to enhance device performance by preventing overheating while maintaining a sleek profile. How It Works The XMC-2400 utilizes ultrasonic modulation to generate pressure pulses that move air efficiently. Weighing under 150 milligrams, it can push up to 39 cubic centimeters of air per second with 1,000 Pascals of back pressure. Its solid-state design eliminates traditional moving parts, reducing the risk of mechanical failure. The chip is also resistant to dust and water, boasting an IP58 rating, and can be mounted directly on heat-sensitive components like APUs and GPUs. Potential Applications Imagine if y...